HyEcoSub™ PCB
Crafted from conductive natural fibers, our HyEcoSub™ PCB substrate material is ingenious, carbon-neutral, and environmentally sustainable.
Embark on a journey of sustainable innovation with our HyEcoSubTM Printed Circuit Board (PCB) substrate. Meticulously crafted from 100% conductive natural fibers, this substrate ensures a carbon-neutral impact while being entirely free from micro-plastic content. Our commitment to sustainability is matched only by the remarkable features of the HyEcoSubTM PCB. Benefit from its exceptional strength, durability, and reliable thermal performance, ensuring your electronics operate at their peak. Plus, delve into the intricacies of PCB technology with key properties and materials at your fingertips.
With low dielectric constant (Dk), our HyEcoSubTM enables high-speed signal transmission with minimal signal distortions and reflections. Also, with lower dissipation factor (Df), our HyEcoSubTM has lower signal losses and better signal integrity. Further, with high thermal conductivity HyEcoSubTM ensures heat generated by power components is dissipated efficiently. And with a coefficient of thermal expansion (CTE) carefully matched with most power component materials, rest assured your devices are safeguarded against thermal stress and mechanical failures.
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Dielectric Constant The low dielectric constant (Dk) of the HyEcoSubTM PCB substrate ensures efficient signal transmission, facilitating high-speed performance and minimizing signal distortions, crucial for maintaining optimal electrical conductivity. |
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High Performance Designed for superior performance, the HyEcoSubTM substrate with its high thermal conductivity delivers reliable functionality comparable to conventional boards, ensuring consistent and efficient operation across various electronic applications. |
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Customisable With customizable options, the HyEcoSubTM PCB substrate offers flexibility to tailor to specific project requirements, allowing for seamless integration into diverse electronic designs. |
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100% Biodegradable Committed to environmental responsibility, the HyEcoSubTM substrate is crafted entirely from biodegradable materials, ensuring minimal environmental impact and promoting sustainability throughout its lifecycle. |
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Zero Plastic Free from any plastic content, the HyEcoSubTM substrate aligns with eco-friendly principles, reducing dependence on non-renewable resources and mitigating plastic pollution. |
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Renewable Practices
Utilizing renewable practices in its production, the HyEcoSubTM substrate promotes sustainable sourcing and manufacturing processes, contributing to a circular economy and minimizing resource depletion.
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Reduced Carbon Footprint By prioritizing eco-conscious materials and manufacturing methods, the HyEcoSubTM substrate significantly reduces its carbon footprint, making it an environmentally preferable choice for electronic applications. |
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Non Toxic Engineered with non-toxic materials, the HyEcoSubTM substrate ensures the safety of both users and the environment, offering peace of mind while maintaining high-performance standards. |
| Product name | Substrate for Printed Circuit Boards (PCB) |
| Brand Name | HyEcoSubTM |
| Dielectric constant (@ 1 GHz) | 4.35 to 4.55 |
| Dissipation factor (@ 1 GHz) | 0.016 |
| Substrate / Laminate thickness | 0.8 to 4 mm |
| Thermal conductivity | 0.3 W/m.K |
| High glass Transition temperature (Tg) | 150 Tg or 170 Tg |
| High Decomposition temperature (Td) | > 345 ºC |
| Low Coefficient of Thermal Expansion (CTE) | 2.5 % to 3.8 % |
| Moisture Absorption Rate | 0.1 % to 0.2 % |
| Laminate or substrate thickness | 0.06 inches to 1.2 inches |
| Pre-preg thickness (Approx. before lamination) | 0.002 inches to 0.060 inches |
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Dielectric Constant The low dielectric constant (Dk) of the HyEcoSubTM PCB substrate ensures efficient signal transmission, facilitating high-speed performance and minimizing signal distortions, crucial for maintaining optimal electrical conductivity. |
|
|
High Performance Designed for superior performance, the HyEcoSubTM substrate with its high thermal conductivity delivers reliable functionality comparable to conventional boards, ensuring consistent and efficient operation across various electronic applications. |
|
|
Customisable With customizable options, the HyEcoSubTM PCB substrate offers flexibility to tailor to specific project requirements, allowing for seamless integration into diverse electronic designs. |
|
|
100% Biodegradable Committed to environmental responsibility, the HyEcoSubTM substrate is crafted entirely from biodegradable materials, ensuring minimal environmental impact and promoting sustainability throughout its lifecycle. |
|
|
Zero Plastic Free from any plastic content, the HyEcoSubTM substrate aligns with eco-friendly principles, reducing dependence on non-renewable resources and mitigating plastic pollution. |
|
|
Renewable Practices
Utilizing renewable practices in its production, the HyEcoSubTM substrate promotes sustainable sourcing and manufacturing processes, contributing to a circular economy and minimizing resource depletion.
|
|
|
Reduced Carbon Footprint By prioritizing eco-conscious materials and manufacturing methods, the HyEcoSubTM substrate significantly reduces its carbon footprint, making it an environmentally preferable choice for electronic applications. |
|
|
Non Toxic Engineered with non-toxic materials, the HyEcoSubTM substrate ensures the safety of both users and the environment, offering peace of mind while maintaining high-performance standards. |
| Product name | Substrate for Printed Circuit Boards (PCB) |
| Brand Name | HyEcoSubTM |
| Dielectric constant (@ 1 GHz) | 4.35 to 4.55 |
| Dissipation factor (@ 1 GHz) | 0.016 |
| Substrate / Laminate thickness | 0.8 to 4 mm |
| Thermal conductivity | 0.3 W/m.K |
| High glass Transition temperature (Tg) | 150 Tg or 170 Tg |
| High Decomposition temperature (Td) | > 345 ºC |
| Low Coefficient of Thermal Expansion (CTE) | 2.5 % to 3.8 % |
| Moisture Absorption Rate | 0.1 % to 0.2 % |
| Laminate or substrate thickness | 0.06 inches to 1.2 inches |
| Pre-preg thickness (Approx. before lamination) | 0.002 inches to 0.060 inches |
Applications
PCB can be found almost everywhere in everything from small consumer devices to huge pieces of machinery.
- Medical Devices
- LEDs
- Consumer Electronics
- Industrial Equipment’s
- Automotive Components
- Aerospace Components
- Maritime Applications
- Safety & Security Equipment’s
- Telecommunications Equipment’s
- Military & Defence Applications
HyEcoSubTM
HyEcoSubTM with copper laminate
HyEcoSubTM PCB
Environmental Impact
Choosing HyEcoSub™ PCB means choosing materials with a significantly lower carbon footprint compared to traditional alternatives.
Our dedication to sustainability extends beyond the product itself, encompassing the entire lifecycle, from sourcing to disposal.
Valures are for the manufacturing and production of a 2 cubic meter product.
*The estimates are calculated based on the data from Global Greenhouse Gas Emissions, Global Emission reports and scientific articles.
Our Circular Products
Choose J.S.HyE-META HyEcoSub™ for a greener, more responsible future.
Sustainable
Quality Assurance
